n.倒裝

adj.倒裝

The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers. 倒裝焊晶片預(yù)計(jì)由三百四十萬(wàn)片(2000年)增長(zhǎng)至二千六百二十萬(wàn)片(2005年)。

Pb is exempted if its composition is >85%. As for the flipchip bump, how do we measure this composition? 問(wèn):成分大于85%25的鉛不在指令范圍內(nèi)．如果是倒裝焊,我們應(yīng)該怎樣測(cè)量它的成分？

The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%. 倒裝焊晶片市場(chǎng)預(yù)計(jì)年增長(zhǎng)37%25，而整體IC增長(zhǎng)僅8%25。